New Generation of Advanced Flash for Connected Platforms

Today’s embedded applications demand innovative non-volatile memory (NVM) solutions in order to meet the diverse requirement of connected platforms.  As the largest supplier of serial NVMs, Winbond continues its broad application coverage by offering SpiStack, 1.2V flash, and Authentication memories.

Do you want scalable, secured memory solutions which allow you to utilize existing flash memory layout to harden system level security without additional hardware? So you should attend this webinar!

In this Webinar

  • you will learn more about how SpiStack combines the fast random access and XIP capability of NOR with the density and cost effectiveness of NAND in one small, low-pin-count SPI package and
  • we will show you how to reduce your energy consumption thus extending the battery life of coin cell operated IOT devices. 


 


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B & S / ECE Magazine

- latest issue is online now -

June 2018

Content Highlights

Cover Story

The challanges of IoT security and how to harden the edge

Download now