Artificial Intelligence on the Edge

This article introduces UP AI Edge, a platform which is fully powered by Intel technology and integrates: Intel Apollo Lake-I CPU, Intel Cyclone 10 gx FPGA, and Intel Movidius Myriad 2 VPU (Video Processing Unit), and represents a completely new paradigm for AI in the industrial embedded market.


By Fabrizio Del Maffeo, Aaeon                     Download PDF version of this article


Deep Learning, Machine Learning and Artificial Intelligence (AI) have recently reached the hype of expectation in the consumer market. While pure AI still seems to be far away, sophisticated Machine Learning solutions have reached the plateau of productivity and are part of our everyday life. Some of these technologies are now entering the industrial and the Internet of Things market, spreading intelligence in our connected world. Hereby, the biggest constraints of the field deployment of AI on the Edge used to be as follows. 1) Cost of the solution: no optimized hardware was available and the most common solution was to use a high-performance CPU + GPU. 2) Power consumption of the solution: a CPU + GPU approach delivers high performance at high thermal dissipation power. 3 Robustness of the solution: the technologies used were designed for big data centers, where temperature range, vibration and other industrial requirements were not needed.

Recent progress in Machine Learning technology, as well as new silicon chips, permits to expand AI from cloud computing to edge computing. AAEON Technology Europe and its line UP Bridge The Gap are now releasing an unique platform, which can overcome all the previous limitations: UP AI Edge. This platform is fully powered by Intel technology and it integrates: Intel Apollo Lake-I CPU, Intel Cyclone 10 gx FPGA, and Intel Movidius Myriad 2 VPU (Video Processing Unit). UP AI Edge delivers unmatched performance and it represents a completely new paradigm for AI in the industrial embedded market.

The mainboard is UP Core Plus, a credit-card-sized board (55 mm x 90 mm) powered by Intel Apollo Lake-I family. Intel Apollo Lake-I platform is a 64-bit QuadCore architecture with extremely high performance in only 9.5W of TDP (x5 – 3940). The board supports up to 8GB Dual Channel DDR4 2.400 MHz, DP up to 4K, eDP, 2 USB 2.0, 1 USB 3.0, 1 USB 3.0 OTG, WiFi 802.11 AC 2T2R, 2 x CSI and it has two 100-pin high speed connectors to expand it.

The companion board UP AI Plus is powered by Intel Cyclone 10gx (105KLe-220KLe), has 1 GB DDRIII, and is DPin connected to the Cyclone for Video Acquisition, and USB Type-C and GPIO connected to the Cyclone for data acquisition. LVDS in connected to the Cyclone for Camera acquisition, GBit Ethernet, USB 3.0 and mini-PCIe connected to the mainboard via the 100-pin connector. Thanks to a collaboration with Basler, the worldwide leader of industrial Machine Vision camera solutions, UP AI Plus is compatible with selected Basler cameras, which can be seamlessly connected via LVDS. UP AI Plus can be used to process streams of high speed raw data – e.g. from cameras – or to run video acceleration, real time video data analysis, video acquisition and many other functions. Different applications can run just by loading the specific IP inside the FPGA.

Because of the mini-PCIe, the companion board UP AI Plus can host UP AI Core, a mini-PCIe module powered by Movidius Myriad 2. Myriad 2 is the most advanced low power technology for running a neural network on the edge and for processing video images. It has been adopted by DIJ for their professional drones, as well as from Amazon and Google for different other products. UP AI Core is fully compatible with the Intel Neural Compute Stick libraries and tools. UP AI Edge will also be available as an industrial rugged AI gateway for deployment in harsh environments.

For software support, UP AI Edge will be supported by the UP Community and from the Intel Network Compute Stick for all the software questions related to UP AI Core (Myriad 2).  UP AI Edge will be in mass production in June 2018, but people can start pre-ordering it to support the project from April onwards on Kickstarter, as well as from May 2018 on UP Shop and with all resellers and partners of UP and AAEON. The price will start at $399 US for the complete platform.


Related


Cloud for flat-panel controllers and RFID readers

The first cloud for flat-panel controllers offers full connectivity to enable central parameterization and constant monitoring of the operational status of displays. This brings two clear advantages: ...

PCAP Touch displays - what does the future hold?

In this article the author compares three different touch technologies and examines their suitability for industrial applications. Figure 1. Example of a touch panel with Force Touch in a medic...

 


Dirk Giesen describes the Parasoft tool suite for Embedded Software Development

Are you responsible for embedded software development in your organization? Your goal should be to create safe, secure, and reliable software. To make sure your device will work properly, deploy Paras...


Ross Sabolik of Silicon Labs talks about advanced Power over Ethernet

In this video Ross Sabolik of Silicon Labs talks about smart  Power over Ethernet systems with Alix Paultre at their APEC exhibit in San ANtonio, Texas. As PoE migrates to higher power levels and...


Dialog Semi walks through their latest IC solutions for battery chargers

In this video an engineer from Dialog Semiconductor walks us through their latest ICs for battery chargers at APEC 2018. Dialog's Qualcomm Quick Charge adapter solutions offer high efficiency to e...


Steve Allen of pSemi explains their latest LED driver solution

Steve Allen of pSemi explains their latest LED boost product based on Arctic Sand's two-stage architecture. Their PE23300 has a charge-pump, switched-capacitor architecture that offloads most of t...


Teledyne describes their latest 12-bit Wavepro HD oscilloscope

In this video Teledyne LeCroy describes their latest Wavepro HD oscilloscope to Alix Paultre of Power Electronics News at the company's launch event. The WavePro HD high-definition oscilloscope de...


Dialog Semi walks through their latest IC solutions for battery chargers

In this video an engineer from Dialog Semiconductor walks us through their latest ICs for battery chargers at APEC 2018. Dialog's Qualcomm Quick Charge adapter solutions offer high efficiency to e...


ROHM explains their latest wireless battery charger solution kit

In this video an engineer from ROHM goes over their latest wireless power development kit, co-developed with Würth for embedded development. The kit provides a complete wireless power transfer sy...


Tektronix describes their latest mixed-signal oscilloscope

In this video Tektronix explains the features in their latest 5 Series MSO Mixed Signal Oscilloscope. Features include an innovative pinch-swipe-zoom touchscreen user interface, a large high-definitio...


AVX shows a supercapacitor demonstrator at APEC

In this video Eric from AVX explains their supercapacitor demonstrator box at APEC 2018 in San Antonio, Texas. The box shows how a 5V 2.5-farad supercapacitor can quickly charge up using harvested ene...


OnSemi explains their latest passive smart wireless sensor for industrial applications

In this video On Semiconductor explains their latest wireless sensor for hazardous environments at APEC in San Antonio, Texas. Intended for applications like high-voltage power cabinets and other plac...


TI demonstrates an improved gaming power system at Embedded World

In this video Texas Instruments' explains Significant reduction in ripple, which results in improved reliability and increased design margins, among other advantages. Another benefit that improve...


Infineon explains their latest motor drive technology at APEC 2018

In this video Infineon demonstrates new gate drivers using their LS-SOI technology at APEC 2018. In the demo Victorus, an Infineon application engineer, shows in real time how much better thermal the ...


STMicro goes over their latest wireless-enabled microcontroller for the IoT

In this video STMicroelectronics goes over their latest wireless-enabled STM32WB microcontroller for the IoT and intelligent devices in several live connectivity demonstrations at Embedded World 2018....