Why reliable, Industrial temperature memory device is crucial in IIoT and the realms of Connected World

In the coming years, tens of billions of IoT device will be connected and generate massively intertwined data collected from sensors, devices through the IIoT (Industrial Internet of Things) applications.

Industrial IoT device and applications will strive for more cloud memory data storage solutions that will enable us to build and live in a better, connected World. However, not every piece of data operating under IIoT will be uploaded to the cloud; instead, a good portion of IoT memory data will be stored, processed and analyzed at the center of edge computing, which inevitably, demands edge to act quicker with higher data reflex and reliability. The challenge is that edge computing typically operates in remote areas that are exposed to extreme H/L temperatures in harsh environmental conditions.

To overcome 'bad weather,' and for stored IoT memory in edge to stay functional under extreme H/L temperature variations, ATP Electronics has successfully developed a new (Industrial Temperature) iTemp MLC solution, best suited for IIoT/ industrial applications.

The new iTemp MLC solution strikes a great balance between cost as well as placing memory reliability as its priority; by conducting strict iTemp validation testing technologies in both IC / NAND Flash level screening process and H/L temperature test to ensure that MLC type NAND Flash reliability is uncompromised in sand or snow environments (-40°C~+85°C).

Is your 'Reliability' iTemp storage really up to the task in harsh H/L temperature environments?

There is a common misconception that by, simply using ready-made industrial-rated components, the iTemp storage is then able to reliably operate in extreme H/L temperatures, where in fact, there's more parameters to cover.

The parameters that affect reliability - NAND characteristics and temperature influence.

As lithographies shrink, there is significant impact on NAND Flash quality. Smaller lithography manufacturing processes tend to raise the numbers in defective parts, which in result equates to uneven manufacturing quality of ICs/NAND flash per module. Also, as manufacturing process matures, data reliability, RBER (Raw Bit Error Rate) and ELFR (Early Life Failure Rate) is also heavily impacted; fewer electrons stored per memory cell can lead to an increase in the number of bit errors, which decreases data retention, as well as its endurance.

In addition, NAND flash reliability is also heavily influenced by the variations in temperature; the variation in temperature causes the changes of the charge distribution in NAND flash, which might cause ill-effects like data retention decreases and to make matters worse, data loss.

Efficient testing mechanism can dramatically reduce influences that negatively impact reliability.

With years of experienced in NAND flash technology/application and physical characteristics of the NAND understanding, ATP Electronics’s iTemp MLC solution has adopted strict validations to support customers’ high product reliability and long-term PLC (product life cycle) requirements in demanding temperatures.

IC Level Test for proper ECC criteria setting. Adopt NAND Flash IC test to verify how ECC and H/L temperature influences the P/E endurance, data retention and operating life of NAND flash. Different levels of ECC bits/1KB setting is tested across varied temperatures to find out the best suited ECC criteria for further RDT reference.

Product Level RDT (Reliability Demonstration Test) for reliability enhancement. Based on the features of NAND instead of pure brute force copy compare, ATP has executed intelligent product level RDT process factoring in H/L temperatures for product quality assurance. By pre-referencing stringent of ECC criteria and adopting stress burn-in test of read/write at temperatures at -40°C and +85°C, ATP's RDT comprehensively tests the whole drive (firmware/user area/spare area included) block by block; weak blocks will then be filtered out and marked as bad blocks condition after the RDT test.

To strengthen memory endurance, ATP double checks the amount of spare blocks in order to make sure that enough valid (good) block remains to replace all failing (over the lifecycle) blocks. Furthermore, not only for NAND flash products, the iTemp MP Level validation test runs across SATA interface as well; a SATA interface testing mechanism is conducted to verify that signal quality is at an optimal level for SATA device running at high speed.

In conclusion, unlike general testing of NAND IC component, ATP's iTemp (industrial Temperature) MLC solutions passes through a strict, rigid RDT advanced test for the entire storage drives (IC/NAND Flash/signal of SATA interface); by stressing H/L temperatures as accelerate factored to reduce the infant mortality and sort out flaws which delivers enhanced reliability and prolonged product lifespans.  ATP's iTemp (industrial Temperature) MLC solutions are capable of fulfilling the demands of extreme IIoT/field applications and achieve the best total cost ownership (TCO) for users to build a better, connected World.

www.ATPINC.com


Related


ADLINK and NVIDIA: AI at the Edge

ADLINK and NVIDIA are working together now to deliver Edge Computing products which include AI and deep learning technologies. At Embedded World, where ADLINK demoed autonomous mobile robotics and oth...

Make your IoT computing efficient and secure

Cloud, Edge and Fog computing is everywhere and everybody is talking about it. In industrial surroundings traditional server approaches cannot provide the required robustness for operation in harsh in...

Embedded Computing for Extreme Environments

Designing embedded computer platforms that can cope with extremes in temperature, vibration and humidity demands a focused approach to quality. Delivering truly rugged solutions requires a focused str...

COM Express is heading towards Server-on-Module

With the new revision 3.0 of the most successful Computer-on-Module standard a new pinout Type is added to extend the reach of COM Express to server Type applications. As explained in this White P...

Robust IoT Server Solution for Offshore Drilling

Not many environments are tougher than an offshore drilling platform. Learn how MEN Mikro’s robust rack housing designs and boards meet the industry’s stringent requirements for protec...

Challenges for Safety-Critical AFDX Applications

A growing number of safety-critical avionic solutions are using the “Avionic Full Duplex Switched Ethernet” (AFDX), designated ARINC 664P7, specification for a deterministic aircraft d...

Making interactive Signage more effective

Interactive signage makes advertising more engaging. It invites customers to drive their own experience with a store’s products and brand. However, retailers will find they can get more valu...


Fluffing the Cloud

The synergistic development aspect of electronic design was very apparent these past weeks at the APEC and Embedded World shows, as engineers from around the globe came together in San Antonio, Texas,...

Powerful graphics in squared form factor

Figure 1. The all-in-one eN-GXSOC has been designed and developed for 24/7 use in harsh industrial environments and utilizes an innovative passive cooling system. AMD graphics technology is ent...

Artificial Intelligence on the Edge

This article introduces UP AI Edge, a platform which is fully powered by Intel technology and integrates: Intel Apollo Lake-I CPU, Intel Cyclone 10 gx FPGA, and Intel Movidius Myriad 2 VPU (Video ...

 


Grammatech talks about the importance of software in engineering

In this video Mark Hermeling of Grammatech talks to Alix Paultre after the Embedded World show in Nuremberg about the importance of software verification for security and safety in electronic design. ...


Lattice Semi walks through their booth demos at Embedded World

In this video Lattice Semiconductor walks us through their booth demonstrations at Embedded World 2018. The live demonstrations include an operating IoT remote vehicle, a low-power network used for vi...


Maxim describes their latest security solution at Embedded World 2018

In this video Scott from Maxim Integrated describes their latest security solution at Embedded World 2018. In the live demo he shows the DS28E38 DeepCover Secure ECDSA Authenticator, an ECDSA public k...


Garz & Fricke at Embedded World 2018 - Embedded HMIs and SBCs “Made in Germany”

You are looking for a HMI-system or single components as touches, displays and ARM-based SBCs? Welcome at Garz & Fricke – the Embedded HMI Company! Our offering ranges from typical single co...


ECRIN Systems myOPALE: Remote Embedded Modular Computers

myOPALE™ offers disruptive technology to multiply capabilities of your next Embedded Computers in a smaller foot print thanks to PCI Express® over Cable interconnect, standard 5.25’&rs...


TechNexion rolls out embedded systems, modules, Android Things kits at Embedded World 2018

In this video John Weber of TechNexion talks to Alix Paultre about how the company helps its customers getting products to market faster. By choosing to work with TechNexion, developers can take advan...


Mike Barr talks cybersecurity

In this video Mike Barr, CEO of the Barr Group, talks to Alix Paultre about cybersecurity at the Embedded World conference in Nuremberg, Germany. Too many designers, even in critical spaces like milit...


Ted Marena of Microsemi talks about their scope-free on-chip debug tools

In this video Ted Marena of Microsemi talks about their scope-free on-chip debug tools with Alix Paultre at Embedded World 2018. SmartDebug tool works with the Microsemi FPGA array and SERDES without ...


Infineon demonstrates their iMotion motor control solution at Embedded World

In this video Infineon explains their latest  IMC100 series iMOTION motor control IC at Embedded World 2018 in Nuremberg. The device provides a ready-to-use solution for high-efficiency variable-...


Samsung goes over their new ARTIK IoT development system

In this video James Stansberry of Samsung talks to Alix Paultre about their ARTIK IoT development system at Embedded World in Nuremberg. The family of system-on-modules provide a complete, production-...


Cypress explains their latest low-power 32-bit Arm Cortex-M4 PSoC 6

In this video Allen Hawes of Cypress Semiconductor talks to Alix Paultre about their latest low-power 32-bit Arm Cortex-M4 PSoC 6, designed to provide a secure high-performance MCU for next-generation...