CapTIvate-MCUs von TI - einfach und schnell robuste kapazitive Bedienfelder entwickeln

In diesem Webinar erfahren Sie, wie Bedienfelder mittels kapazitiven Tastern und Reglern einfach und schnell implementiert werden können.

Darüber hinaus lernen Sie die nötigen Hard- und Softwaretechniken, sowie das mechanische Design kennen.

Sprecher

  • Andre Frantzke, Systems Manager, Texas Instruments. Andre Frantzke studierte Elektrotechnik im Bereich Nachrichtentechnik an der HTWK Leipzig. Seit 2004 ist er u.a. als Test- und Applikationsingenieur bei Texas Instruments beschäftigt. Seit 2011 arbeitet er als Systemingenieur und ist für die Definition und Spezifikation von IP’s und SoC’s von MSP430 Mikrocontrollern verantwortlich.


 


Related


Is the Universal Translator Finally Here?

This webinar from NXP will provide a detailed insight on why these advanced, extremely-low power translators from NXP Logic are the solution for your mixed voltage applications! Today's modern,...

Driving lower power for MCU products even lower

The MSP430 microcontroller family from Texas Instruments prides itself on extremely low power consumption. However, their flagship power consumption is contingent upon various properties like supply...


Establishing a root of trust to secure the IoT

Security is not something that any developer can ignore. It is no longer safe, for the OEM or their customers, to assume that their product or service is immune to cyber attacks. The sheer size of the...

Securing the smart and connected home

With the Internet of Things and Smart Home technologies, more and more devices are becoming connected and therefore can potentially become entry points for attackers to break into the system to steal,...

Acoustic MEMS - letting systems listen to the world

Ambient intelligence is fast becoming a mainstream technology. Many homes now have some form of smart speakers that understand spoken commands. Car dashboards and navigation systems use voice control ...

Mass Connectivity in the 5G Era

5G will achieve faster transmission rates, more powerful data exchange networks, and more seamless real-time communication, which will enable tremendous growth for advanced and innovative connectivity...

 


E-Mail Newsletters

nlsc240

Our 3 E-Mail Newsletters: EETimes/EDN Europe, Embedded News and Power Electronics News inform about the latest news in technology and products, as well as technical know-how like white papers, webinars, articles, etc.


B & S / ECE Magazine

- latest issue is online now -

June 2018

Content Highlights

Cover Story

The challanges of IoT security and how to harden the edge

Download now